View TC1262-33VDBMR_8495841.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? 2002-2012 microchip technology inc. ds21373c-page 1 tc1262 features very low dropout voltage 500ma output current high output voltage accuracy standard or custom output voltages over current and over temperature protection applications battery operated systems portable computers medical instruments instrumentation cellular/gsm/phs phones linear post-regulators for smps ? pagers device selection table note: xx indicates output voltages. available output voltages: 2.5, 2.8, 3.0, 3.3, 5.0. other output voltages are avail able. please contact microchip technology inc. for details. package type general description the tc1262 is a fixed output, high accuracy (typically 0.5%) cmos low dropout regulator. designed specif- ically for battery-operated systems, the tc1262s cmos construction eliminates wasted ground current, significantly extending battery life. total supply current is typically 80 ? a at full load (20 to 60 times lower than in bipolar regulators). tc1262 key features include ultra low noise operation, very low dropout voltage (typically 350mv at full load), and fast response to step changes in load. the tc1262 incorporates both over temperature and over current protection. the tc1262 is stable with an output capacitor of only 1 ? f and has a maximum output current of 500ma. it is available in 3-pin sot-223, 3-pin to-220 and 3-pin ddpak packages. typical application part number package junction temp. range tc1262-xxvdb 3-pin sot-223 -40c to +125c tc1262-xxvab 3-pin to-220 -40c to +125c tc1262-xxveb 3-pin ddpak -40c to +125c v in v in v out gnd g nd v ou t tab is gnd front vi ew front vi ew 1 1 2 3 3 2 tab is g n d tc1262 t c 12 62 v in v out t c 12 62 3 -pin t o -22 0 tab is g n d 3 -pin so t-22 3 3-pin ddpa k 1 2 3 g nd tc1262 v in v out c11 f gnd v out v in + 500ma fixed output cmos ldo downloaded from: http:///
tc1262 ds21373c-page 2 ? 2002-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings* input voltage .........................................................6.5v output voltage.................. (v ss C 0.3v) to (v in + 0.3v) power dissipation................internally limited (note 6) maximum voltage on any pin ........v in +0.3v to -0.3v operating temperature range...... -40c < t j < 125c storage temperature..........................-65c to +150c *stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. tc1262 electrical specifications electrical characteristics: v in = v out + 1v, i l = 100 ? a, c l = 3.3 ? f, t a = 25c, unless otherwise noted. boldface type specifications apply for junction te mperatures of -40c to +125c. symbol parameter min typ max units test conditions v in input operating voltage 2.7 6.0 v note 7 i out max maximum output current 500 m a v out output voltage v r ? 2.5% v r 0.5% v r + 2.5% v note 1 ? v out / ? tv out temperature coefficient 40 ppm/c note 2 ? v out / ? v in line regulation .003 0.35 %/v (v r + 1v) ?? v in ??? 6v ? v out /v out load regulation 0.002 0.01 %/ma i l = 0.1ma to i out max (note 3) v in -v out dropout voltage 2060 200350 30 130390 650 mv i l = 100 ? a i l = 100ma i l = 300ma i l = 500ma (note 4) i dd supply current 80 130 ? ai l = 0 psrr power supply rejection ratio 64 db f re ?? 1khz i out sc output short circuit current 1200 ma v out = 0v ? v out / ? p d thermal regulation 0.04 v/w note 5 en output noise 260 nv/ ? hz i l = i out max , f re = 10khz note 1: v r is the regulator output voltage setting. 2:3: regulation is measured at a constant junction temperature using low duty cycle pulse testing. loa d regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: dropout voltage is defined as the input to output differential at which the output voltage drops 2% below it s nominal value mea sured at a 1v differential. 5: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipat ion is applied, exclu ding load or line regulation effects. specifications are for a current pulse equal to i l max at v in = 6v for t = 10 msec. 6: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable j unction temperature and th e thermal resistance from junction-to-air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see section 4.0 thermal considerations for more details. 7: the minimum v in has to justify the conditions: v in ? v r + v dropout and v in ? 2.7v for i l = 0.1ma to i out max . tc v out = (v out max C v out min ) x 10 6 v out x ? t downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page 3 tc1262 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table 3.0 detailed description the tc1262 is a precision, fixed output ldo. unlike bipolar regulators, the tc1262s supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i load max load current range (an important consideration in rtc and cmos ram battery back-up applications). figure 3-1 shows a typical application circuit. figure 3-1: typical application circuit 3.1 output capacitor a 1 ? f (min) capacitor from v out to ground is required. the output capacitor should have an effective series resistance greater than 0.1 ? and less than 5 ? , and a resonant frequency above 1mhz. a 1 ? f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approximately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. pin no. (3-pin sot-223) (3-pin to-220) (3-pin ddpak) symbol description 1v in unregulated supply input. 2 gnd ground terminal. 3v out regulated voltage output. c11 f battery tc1262 v in v out c21 f gnd v out + + + ? downloaded from: http:///
tc1262 ds21373c-page 4 ? 2002-2012 microchip technology inc. 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ? ja ). equation 4-2: table 4-1 and table 4-2 show various values of ? ja for the tc1262 packages. table 4-1: thermal resistance guidelines for tc1262 in sot-223 package *tab of device attached to topside copper table 4-2: thermal resistance guidelines for tc1262 in 3-pin ddpak/to-220 package *tab of device attached to topside copper equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max = 3.3v 10% v out min = 2.7v 0.5% i load max = 275ma t j max = 125c t a max = 95c ? ja = 59c/w (sot-223) find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d ? (v in max C v out min )i load max = [(3.3 x 1.1) C (2.7 x .995)]275 x 10 C3 = 260mw maximum allowable power dissipation: in this example, the tc1262 dissipates a maximum of 260mw; below the allowable limit of 508mw. in a similar manner, equation 4-1 and equation 4-2 can be used to calculate maximum current and/or input voltage limits. for example, the maximum allowable v in , is found by sustituting the maximum allowable power dissipation of 508mw into equation 4-1, from which v in max = 4.6v. copper area (topside)* copper area (backside) board area thermal resistance ?? ja ) 2500 sq mm 2500 sq mm 2500 sq mm 45c/w 1000 sq mm 2500 sq mm 2500 sq mm 45c/w 225 sq mm 2500 sq mm 2500 sq mm 53c/w 100 sq mm 2500 sq mm 2500 sq mm 59c/w 1000 sq mm 1000 sq mm 1000 sq mm 52c/w 1000 sq mm 0 sq mm 1000 sq mm 55c/w where: p d ? (v in max C v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max = (t j max C t a max ) ? ja where all terms are previously defined. copper area (topside)* copper area (backside) board area thermal resistance ?? ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25c/w 1000 sq mm 2500 sq mm 2500 sq mm 27c/w 125 sq mm 2500 sq mm 2500 sq mm 35c/w p d max = (t j max C t a max ) ? ja = (125 C 95) 59 = 508mw downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page 5 tc1262 5.0 typical characteristics note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. output noise vs. frequency frequency (khz) noise ( v/ hz) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 r load = 50 ? c out = 1 f 0.020 0.018 0.016 0.012 0.0100.008 0.006 0.004 0.002 0.000 0.014 temperature ( c) line regulation vs. temperature line regulation (%) -40 c0 c25 c70 c85 c 125 c -40 c0 c25 c70 c85 c 125 c 0.01000.0090 0.0080 0.0070 0.00600.0050 0.0040 0.00300.0020 0.0010 0.0100 temperature ( c) load regulation vs. temperature load regulation (%/ma) 1ma to 500ma 1ma to 500ma 5v 2.5v temperature ( c) i dd ( a) 150 135120 105 9075 60 4530 15 0 i dd vs. temperature 5v -40 c0 c25 c70 c85 c 125 c 0 100 300 4 00 500 i load (ma) 0 100 2 00 300 4 00 500 i load (ma) 2.5v dropout volta g e vs. i l o a d dropout voltage (v) 2.5v 0.50 0.400.30 0.20 0.10 0.00 0.50 0.400.30 0.20 0.10 0.00 l o a d d ropout voltage ( v ) 2 5 c -4 0 c -40 c 0 c 0 c 7 0 c 7 0 c 85 c 1 1 2 5 c 85 c 25 c 12 5 c 2.702.50 2.30 2.10 1.90 1.70 1.50 -40 c 0 c25 c70 c85 c 125 c temperature ( c) 2.5v v out vs. temperature i l = 0 .1m a i l a = 300 m a i i i l a a = 500 m a 5.205.10 5.00 4.90 4.80 4.70 4.60 4.50 4.40 4.30 4.20 4.10 4.00 -40 c 0 c25 c70 c85 c 125 c temperature ( c) 5.0v v out vs. temperature v out (v) v out (v) i l = 0 .1m a i i i l i i i l downloaded from: http:///
tc1262 ds21373c-page 6 ? 2002-2012 microchip technology inc. 6.0 packaging information 6.1 package marking information package marking data not available at this time. 6.2 taping form component taping orientation for 3-pin sot-223 devices package carrier width (w) pitch (p) part per full reel reel size 3-pin sot-223 12 mm 8 mm 4000 13 in carrier tape, number of components per reel and reel size user direction of feed device marking pin 1 standard reel component orientationfor tr suffix device (mark right side up) w p component taping orientation for 3-pin ddpak devices package carrier width (w) pitch (p) part per full reel reel size 3-pin ddpak 24 mm 16 mm 750 13 in carrier tape, number of components per reel and reel size user direction of feed device marking pin 1 standard reel component orientationfor tr suffix device (mark right side up) w p downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page 7 tc1262 6.3 package dimensions .264 (6.70).248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30).264 (6.70) .146 (3.70).130 (3.30) .091 (2.30) typ. .071 (1.80) max. .181 (4.60) typ. .036 (0.91) min. .041 (1.04).033 (0.84) pin 1 .013 (0.33).009 (0.24) .031 (0.80).024 (0.60) .004 (0.10).001 (0.02) 10 max. 3-pin sot-223 dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
tc1262 ds21373c-page 8 ? 2002-2012 microchip technology inc. package dimensions (continued) 3-pin to-220 .205 (5.21).195 (4.95) pin 1 .113 (2.87).103 (2.62) .410 (10.41) .357 (9.06) .156 (3.96).146 (3.71) dia. .258 (6.55).230 (5.84) .560 (14.22).518 (13.16) .105 (2.67).095 (2.41) .037 (0.94).027 (0.69) .055 (1.40).045 (1.14) .244 (6.20).234 (5.94) .185 (4.70).165 (4.19) .055 (1.40).045 (1.14) .594 (15.09).569 (14.45) .115 (2.92).095 (2.41) .020 (0.51).012 (0.30) 3 - 7.5 5 plcs. dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging .100 (2.54) typ. 3-pin ddpak .037 (0.94).026 (0.66) .370 (9.40).330 (8.38) .067 (1.70).045 (1.14) .605 (15.37).549 (13.95) .410 (10.41) .385 (9.78) .183 (4.65).170 (4.32) .055 (1.40).045 (1.14) .010 (0.25).000 (0.00) .110 (2.79).068 (1.72) .026 (0.66).014 (0.36) .051 (1.30).049 (1.24) 8 max. 3 - 7 (5x) pin 1 dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging sp ecification located at http://www.microchip.com/packaging downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page 9 tc1262 7.0 revision history revision c (november 2012) added a note to each package outline drawing. downloaded from: http:///
tc1262 ds21373c-page 10 ? 2002-2012 microchip technology inc. notes: downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page11 tc1262 sales and support data sheets products supported by a preliminary data sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. to determine if an erra ta sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. downloaded from: http:///
tc1262 ds21373c-page12 ? 2002-2012 microchip technology inc. notes: downloaded from: http:///
? 2002-2012 microchip technology inc. ds21373c-page 13 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2002-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767788 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
ds21373c-page 14 ? 2002-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/27/12 downloaded from: http:///

▲Up To Search▲

Price & Availability of TC1262-33VDBMR

	To Download TC1262-33VDBMR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .